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Precision parts for semiconductor manufacturing equipment in Osaka - Philir Co., Ltd.

Machined parts of semiconductor manufacturing equipment A5052 round [Leave cost reduction to Philir Co., Ltd.]

♦Material A5052 (Aluminum) ♦Industry Semiconductor manufacturing equipment LCD manufacturing equipment ♦Processing Method Composite lathe ♦Surface Treatment Processing (within Japan) ♦Quantity 100 to 500 pieces ♦Description This is a processing method using one-chucking on a composite lathe. *Please feel free to request a quote, and we will respond to your company's needs. We look forward to your inquiries after visiting our website. =-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=- Fi-Réal Co., Ltd. Sales Department, Yoshikazu Demizu 570-0043 6-11-12 Minamiterakatahigashi-dori, Moriguchi City, Osaka Prefecture TEL: 06-7493-8864 FAX: 06-7493-8871 Mobile: 070-3885-7735 E-mail: demizu@fi-real.com Website: https://fi-real.com/

  • CVD Equipment
  • Precision cutting parts for devices

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